INNO6 utilizes cutting edge laser processing technology in various fields.
Since the development of ruby laser in 1960s, many other laser equipment came out and now, these lasers are widely used across academic and industrial fields. Processing technology using laser belongs to an advanced science category. Therefore, it is important to understand and utilize properly the interaction between characteristics of materials to be processed and laser beam and materials. To understand and utilize the laser processing technology properly, one has to know various engineering fields such as physical optics, mechanical engineering, and material engineering.
With above advantages, laser processing technology is widely used in overall industries as well as for the large output laser output such as automobile and steel, for the precise processing of semi-conductor and display, and for medical treatment. neering fields such as physical optics, mechanical engineering, and material engineering.
Depending on the type of laser, its processing technology can be applied to various fields.
Activity field according to laser type
|Category||Laser type||Activity field|
|Ultraviolet < 400nm||Excimer Laser (191, 249, 308, 351), Nd-YAG Laser||Ultra precision processing (film deposition, circuit elimination)|
|Visible Ray 400~700nm||He-Ne Laser (543, 594, 612, 632), Ar Laser (514, 488, 476, 501), Nd-YAG (355, 532)||for specific lighting and display, for medical purpose, regular processing|
|Infrared Ray ＞700nm||He-Ne Laser (1150, 1520, 3390), CO2 Laser (9300~10600), Nd-YAG Laser (1064, 1320)||for processing (dissolution), various medical purpose, communication equipment|
|Tunable||Organic dye laser (200~1200), Diode Laser (275~12500)||for research|
|Marking||Various information (type, logo and brand, date of construction) can be carved on different materials such as semi-conductor, surface of wafer chip, and inside FPD board. It can be used for general products such as ID card, metal, vehicle, and electrical and electronics products.|
|Cutting||Transfers PMMA, BLU LGP, GLASS, Flexible PCB, Rigid-PCB, and polarized film.|
|Trimming||For the LCD electricity test, it eliminates electrode in exterior circuit.|
|Drilling||It is used to forming hole in PCB.|
|Dicing & Scribing||Cuts wafer or board into a chip unit or forms a cutting line. It is useful for LED which uses highly intensive sapphire wafer and packagers using ceramic board. Scribing of both front and back sides are possible.|
|Repairing||In the process of TFT-FPD and AM OLED, after the characteristics test, cut faulty short detected with laser and repair it.|
|Patterning||It patterns ITO on film or surface of glass.|
|Welding||By using the optical lens, a similar density with electric beam can be obtained. Thus, it can be used as a processing heat source for welding, cutting, and perforation like eclectic beam.|
La ser process technology contains 3 core factors.
Optimized laser selection Optimal laser selection for the processing materials of target object Structure of stable system for selecting optimal laser parameter through tests and experiences
Delicate optical design Delicate optical design appropriate for purpose and application of processing material Structure of regular optical components and specially-designed optical for the composition of various types of laser beams.
Stable system structure Structure of stable hardware and software system for the outstanding quality and optimal production control of laser and optical components, safe optical equipment development, delicate processing environment (precipitation, gas, etc), and precise stage structure
Based on the many experiences and abilities Inno 6 has, it is concentrating on its core competence on all material industry necessary for precise processing of semi-conductors, display and medical. Thus, it is trying to grow into a new general leader in the field of high-tech laser processing facility.
Equipment for precisely patterning electrodes such as displays, medical robots, and solar cells using a laser